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Will do joint R&D on semiconductor EUV photomasks.
February 8, 2024
By: DAVID SAVASTANO
Editor, Ink World Magazine
Toppan Photomask has entered into a joint research and development agreement with IBM related to the 2 nanometer (nm) logic semiconductor node, using extreme ultraviolet (EUV) lithography. This agreement also includes High-NA EUV photomask development capability on next-generation semiconductors. Based on this agreement, for a period of five years starting 1Q 2024, IBM and Toppan Photomask plan to develop photomask capability at the Albany NanoTech Complex (Albany, NY, USA) and Toppan Phot...
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